Bambu lab x1e ams combo auto bed leveling high speed core xy multicolour printing 320c bambulab stable fdm printer

Bambu Lab X1E AMS Combo

RM12,999.00

Product Features

Secure Network Connection
High-speed CoreXY
Active Chamber Heating
320°C Max Nozzle Temperature
AI-powered Print Failure Detection
Powerful Air Filtration System

3 in stock

Order Info

Order will be shipped out from our KL warehouse in 1-3 business days once being processed.
If you need Lalamove once purchased, WhatsApp to our phone for quick arrange delivery.

Accepted Payment Methods - Visa, Mastercard, American Express, PayPal, FPX, Atome

SKU: BAMBULAB-X1-X1E-AMSCOMBO Categories: Enclosed Printers, FDM 3D Printers, Industrial Printer, 3D Printers Tag: Bambu Lab Brand: Bambu Lab

Bambu Lab X1E Overview

Enterprise-Ready, AI-Smart, Performance Unleashed — Precision Printing with Industrial Confidence.

Bambu Lab X1 Carbon Overview

The X1E offers the option to connect to your devices through its newly added Ethernet port, ensuring robust network communication in complex environments. Ethernet connectivity can also be used in crowded wireless signal environments. Additionally, the X1E provides WPA2-Enterprise Wi-Fi Authentication (EAP-PEAP/EAP-TLS/EAP-TTLS) and individual physical kill switches for both Wi-Fi and Ethernet, meeting stringent network security requirements.

WPA2-Enterprise Authentication

Stable Ethernet Connection for Extra Security

The X1E can operate independently without a connection to Bambu Cloud Service, fully functional within your local network. Customers can remotely control the X1E through LAN communication without requiring an Internet connection.

We combined a G3 pre-filter, an H12 HEPA filter, and a high-quality coconut shell activated carbon filter to provide optimal air filtration. Enhanced filtration can effectively reduce excessive odors and particulates when printing in less ventilated environments.

Effectively Filter Particulates And VOCs Generated by 3D Printing

The X1E can actively heat and regulate the chamber temperature. Accurately controlled chamber temperature (up to 60°C or 140°F) improves print quality, especially for filaments prone to warping such as ABS and PC.

Reduce Warping, Improve Layer Bonding

Higher nozzle temperature make possible to print higher performance materials such as PPA-CF/GF, PPS and PPS-CF. These new materials have better dimensional stability, heat resistance and mechanical performance.

More Heat For Higher Temperature Materials

The superior carbon-fiber rods in the CoreXY motion structure enable the X1E to achieve a toolhead acceleration of 20,000 mm/s² by reducing the weight of moving parts. This faster acceleration allows the X1E to maintain its maximum travel speed of 500 mm/s for longer periods, significantly reducing overall print time.

Super Fast And Rigid Structure For Continuous High Speed Printing

X1E can actively compensate for XY-axis vibrations and extrusion issues to ensure exceptionally smooth print quality. All measurements are fully automatic, eliminating the need for manual adjustments.

Stable & Quality Prints Even At Higher Speeds

The X1E’s AI algorithm can detect first-layer imperfections and spaghetti failures with the assistance of Lidar and computer vision. It then automatically pauses the print to prevent catastrophic failures.

Reduce Filament Wastage And Machine Downtime

X1E can parallel connect 4 Bambu AMS systems to print with up to 16 spools of filaments, good for printing dedicated support materials for seamless surface and printing multi-color. The AMS system also supports automatic filament reload to make sure you use all the filament on your spool before switching to a new one

Supports Auto Filament Reload and Enables Multi-Material Printing with Support Material for Improved Surface Quality

Detailed Features and Specification

	Bambu Lab X1E	Bambu Lab X1C	Bambu Lab P1S
Build Volume	256 × 256 × 256 mm
Nozzle Temp	up to 320 °C	up to 300 °C
Bed Temp	up to 120 °C		up to 100 °C
Max Power Draw	up to 1400W @ 220V / 750W @ 110V	~1100W @ 220V / 350W @ 110V	~1000W peak during startup
Chamber Heating	Active, up to 60 °C	None
Filament Compatibility	Wide: PLA, PETG, TPU, PA, ABS, ASA, PC, PPA-CF/GF, PPS, etc.	Wide: PLA, PETG, TPU, PA, ABS, ASA, PC, PPA-CF/GF, PPS, etc.	PLA, PETG, TPU, PA, ABS, ASA
Hotend Type	All-metal, hardened steel		All-metal
Connectivity	Wi-Fi (Enterprise WPA2), Ethernet (RJ45)	Wi-Fi
Network Security	802.1X, network kill switch, removable module	None
Air Purification	G3 pre-filter, H12 HEPA, coconut carbon	Coal carbon, no HEPA
Software Support	Bugfixes till 2028, Security till 2030	Bugfixes till 2027, Security till 2029	Bugfixes till 2026, Security till 2028
Chassis Size	389 × 389 × 457 mm
Net Weight	16 kg	14.13 kg