GD900 High Performance Thermal Grease Thermal Paste For 3D Printer CPU Processor Heatsink Plaster Heat Dissipation

RM1.20RM8.40

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SKU: THERMAL-PASTE-GD900 Category:

GD900 is a high-conductivity thermal paste that serves as an excellent thermal interface material. It’s particularly designed for a wide range of temperatures and offers a thermal conductivity of 4.8 W/M-K. It’s perfect for use in various applications, ranging from computer CPUs to other electronics that require efficient heat dissipation. Also compatible with 3D printer heatbreak.

Key Specifications:
Color: Gray
Net Weight: 0.5/1/7/30 Gram
Model Number: GD900 Series
Thermal Conductivity: 4.8 W/M-K
Operating Temperature: -50~200C

Usage Instructions:
Clean the surface before application with a dry wipe.
Apply the thermal paste using a scraper or finger-cots.
Smear the paste evenly, aiming for a thickness similar to that of an A4 paper.

Additional Info:
Compliant with RoHS (Restriction of Hazardous Substances).

Weight0.10 kg
Dimensions5.00 × 5.00 × 1.00 cm
Size

0.5gram (GD900-MB05), 1gram (GD900-SSY1), 7gram (GD900-SY7), 30gram (GD900-SY30)

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GD900 High Performance Thermal Grease Thermal Paste For 3D Printer CPU Processor Heatsink Plaster Heat Dissipation
RM1.20RM8.40 Select options
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