eSUN High Temperature Resin for 3D Printer 500g | Mold | Mechanical | Dental | Automobile | High Temp

RM150.00

Compare
SKU: ESUN-HIGH-TEMP-RESIN-500G Categories: ,

🔥 All are ready stock in Sungai besi office & ship within 24 hours* (Except for non working day, but do call us to check)

🔥 Select Others (West Malaysia) as shipment if you’d like to opt for self-pickup/by delivery services (Lalamove, Grab, etc ). Contact us after placed order.etc ).

🔥 For KL same day delivery, Please contact us if you’d like to opt for self-pickup/by delivery services (Lalamove, Grab, etc ). Buyers will have to bear the delivery cost and set our Sungai Besi office as pick up point. Do check with us before you purchase as we may not be available.

Good temperature resistance, can be heated for a long time at 120℃ or boiled at 100℃.

With high hardness, high strength and high rigidity, high precision, fully cured model has excellent mechanical properties and temperature resistance.

Can be used for high temperature dental mold, to meet the needs of dental model assembly and manufacturing of fine, high temperature and low deformation.

Application: Mechanical, Dental, Automobile

3D PRINTING PHOTOPOLYMER RESIN Properties Table

3D PRINTING PHOTOPOLYMER RESIN High Temp Resin

Viscosity(mPa·s) 180-220

Density(g/cm3) 1.09-1.10

Tensile Strength(MPa) 70-85

Elongation at Break(%) 35-40

Flexural Strength(MPa) 95-105

Impact Strength(J/m) /

Tearing Strength(GPa) /

Heat Distortion Temp(℃) 100.5(After printing, place in a 150℃ oven for 30 minutes)

Hardness(Shore D) 82-84

Weight0.7 kg
Dimensions5 × 5 × 17 cm
Color

Pink, Transparent

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.

Esun high temperature resin for 3d printer 500g | mold | mechanical | dental | automobile | high temp
eSUN High Temperature Resin for 3D Printer 500g | Mold | Mechanical | Dental | Automobile | High Temp
RM150.00 Select options
Want a cookie?🍪 You can consent to have a better browsing experience.